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2019 Broadcom AFEM-8092 System-in-Package in a Apple iPhone XS/XR Series Teardown Report – ResearchAndMarkets.com

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DUBLIN–(BUSINESS WIRE)–May 15, 2019–

The “Broadcom AFEM-8092 System-in-Package in a Apple iPhone Xs/Xr Series” news has been combined to ResearchAndMarkets.com’s offering.

For a second year, Apple has motionless to adopt innovative record in a radio-frequency (RF) area. In a flagships a association is regulating a latest and many modernized filter and wrapping record from Broadcom, before Avago Technologies, in all new versions of a iPhone, a Xs, Xs max and Xr models. This Front End Module (FEM) is a initial to embody a flip-chip energy amplifier on GaAs substrate and modernized Electro-Magnetic Interference (EMI) shielding, permitting magnitude rope pity in a same System-in-Package (SiP).

In 2018, Broadcom has granted several versions of a iPhone with a same module. Located on a categorical house in opposite configuration, a AFEM-8092 from Broadcom was found in a Apple iPhone Xs Max, Xs and Xr. Like a predecessor, a AFEM-8072, a AFEM-8092 is a Mid and High rope Long Term Evolution (LTE) FEM. It facilities several dies: Power Amplifier, Silicon-on-Insulator Switch and Filters. The Filters are still regulating Avago’s Microcap bonded-wafer Chip Scale Packaging (CSP) record with Through-Silicon Vias (TSVs) enabling electrical contacts and Scandium Doped Aluminum Nitride (AlScN) as a piezoelectric material.

For this special version, Broadcom has integrated dual modernized features. The initial is a relating integrated circuit (IC), featuring several passives for receiver relating on a singular chip. The second is EMI helmet inside a FEM to revoke division between a dies. Moreover, Broadcom has motionless to confederate a energy amplifier in flip-chip configuration. Doing so means that a GaAs dies don’t need TSVs for thermal government any more. Also, a wrapping is easier doing usually flip chip dies, as a routine doesn’t need handle bonding. Thanks to all these innovations, Broadcom is means to supply a new cost-effective two-in-one member with reduced series of input/output (I/O) connections.

The news contains a finish research of a FEM SiP, including a minute research of a relating IC, a filtering dies, a inner and outmost EMI helmet and a Power Amplifier. The news also facilities a cost research and a cost determination of a component. Finally, it also integrates a comparison with a AFEM-8072, Mid/High rope LTE FEMs in a Apple iPhone X, indication numbers A1865 and A1902.

Key Topics Covered:

1. Overview/Introduction

2. Broadcom Company Profile

3. Apple iPhone Xs Max – Teardown

4. Market Analysis

5. Physical Analysis

  • Physical Analysis Methodology
  • Package
  • View and dimensions
  • Package opening:
  • Power amplifier, switch, RF IC, filters
  • Package cross-section:
  • Overview, dimensions, substrate, inner and outmost shielding
  • Package Physical Data Summary
  • Power Amplifier, Switch Die
  • View, dimensions, and markings
  • Die overview and cross-section
  • Matching RFIC Die
  • View, dimensions, and markings
  • Die overview and delayering
  • Die process
  • Die cross-section
  • Filter Dies
  • View, dimensions, opening and markings
  • Die overview:
  • Cap, substrate, cells
  • Die cross-section
  • Sealing frame, anchor, TSV, holes, FBAR structure
  • Filter Physical Data Summary

6. Manufacturing Process Flow

  • Die Process
  • Filter Wafer Fabrication Unit
  • Filter Process Flow
  • Packaging Process Flow

7. Cost Analysis

  • Cost Analysis Overview
  • Main Steps Used in a Economic Analysis
  • Yield Hypotheses
  • Filter Die Cost
  • Front-End (FE) cost
  • Filter wafer Front-End cost per routine step
  • Wafer and die cost
  • Matching RFIC Die Cost
  • Front-End (FE) cost
  • Wafer and die cost
  • Packaging and Module Cost

8. Estimated Price Analysis

9. Comparison with prior Mid/High rope FEM from Broadcom

Companies Mentioned

  • Apple
  • Avago
  • Broadcom

For some-more information about this news revisit https://www.researchandmarkets.com/r/l3kly9

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PUB: 05/15/2019 09:33 AM/DISC: 05/15/2019 09:33 AM

http://www.businesswire.com/news/home/20190515005575/en